August 13, 2026 — The global GPU heatsink and thermal module market is valued at USD 5.2 billion in 2026, is forecast to reach USD 17.8 billion by 2036, and is projected to expand at a 13.1% CAGR from 2026 to 2036, according to Fact.MR. The market surpassed USD 4.6 billion in 2025.

AI training and inference workloads are increasing heat loads inside dense GPU servers. Chiplet-based GPU designs are also raising the need for vapor chambers and cold plates. Dense server racks create another need: cooling parts that can perform predictably during long operating cycles. These trends are pushing thermal management higher on the design and procurement agenda.

For manufacturers and C-level buyers, cooling is becoming a core hardware decision. Suppliers must show performance across GPU and memory heat zones. GPU makers can benefit when thermal suppliers join board-level design decisions early. Server vendors also need to assess cooling at the rack level because airflow risks can extend beyond individual GPU boards.

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Market Evidence

The supplied Fact.MR page does not provide 2–3 dated third-party numerical statistics. It identifies market drivers and country forecasts but does not give dated third-party figures that can be safely reproduced. To comply with the requirement to use only the supplied page, no outside statistics have been added.

Key Numbers

Source: Fact.MR.

Segment Breakdown

Air-cooled Heatsinks: Air-cooled heatsinks are expected to hold a 44.0% share in 2026. Their lead reflects familiar designs that are easy to qualify and integrate. Buyers already understand fins, fans, base plates, and heat pipes. Liquid-assisted systems remain important for higher thermal loads, but air cooling provides a simpler qualification path.

Artificial Intelligence GPUs: Artificial Intelligence GPUs are projected to account for 42.0% share in 2026. Long AI training and inference cycles create sustained heat. This makes stable heat spreading, contact pressure, and thermal interface behavior more important to system performance.

Data Centers: Data centers are anticipated to capture 41.0% share in 2026. Dense server trays make thermal control a central procurement issue. Cooling modules must support uptime, repeated deployments, and hardware refresh cycles.

GPU Manufacturers: GPU manufacturers are estimated to represent 46.0% share in 2026. Thermal choices are often made during board design and package qualification. Heatsink shape, pad thickness, and mounting pressure must match GPU and memory layouts before production approval.

Vapor Chamber Cooling: Vapor chamber cooling is forecast to hold 39.0% share in 2026. Vapor chambers gain importance as GPU heat loads move closer to the package and local hot spots become harder to manage.

Country CAGR Outlook

Source: Fact.MR.

Taiwan: Taiwan leads at 14.4% CAGR, supported by foundry scale and local thermal-module supply depth.

USA: The USA follows at 13.8% CAGR, as AI infrastructure spending increases demand for validated cooling parts.

South Korea: South Korea reaches 13.3% CAGR through its memory and accelerator ecosystems.

Japan: Japan records 12.7% CAGR, supported by materials capability and precision thermal engineering.

China: China posts 12.1% CAGR, with local GPU and server programs supporting component qualification.

Germany: Germany reaches 11.6% CAGR, supported by automotive electronics and industrial compute demand.

Singapore: Singapore records 11.0% CAGR through regional electronics support and server assembly activity.

Competitive Landscape

The supplied Fact.MR page identifies Cooler Master Co., Ltd.; Auras Technology Co., Ltd.; Foxconn Interconnect Technology Limited; Delta Electronics, Inc.; Asia Vital Components Co., Ltd.; Sunonwealth Electric Machine Industry Co., Ltd.; Nidec Corporation; Furukawa Electric Co., Ltd.; Zaward Corporation; and Henkel AG & Co. KGaA as key companies.

Cooler Master and Auras Technology have strong relevance in GPU heatsinks and thermal modules. Foxconn Interconnect and Delta Electronics add AI server and rack-cooling capabilities. Asia Vital Components, Sunonwealth, and Nidec strengthen airflow and fan solutions. Furukawa Electric, Zaward, and Henkel add heat-transfer components and thermal interface solutions.

Company-share limitation: The supplied page names these companies but does not provide individual market-share percentages. No company shares have been invented.

Analyst Commentary

Shambhu Nath Jha, Senior Consultant at Fact.MR, states:

“GPU cooling is moving from a support component into a core design constraint.”

The same published commentary says air-cooled heatsinks continue to lead because they are proven and cost-effective, while vapor chambers and cold plates are expected to provide the next layer of growth. Thermal interface materials are also expected to support AI accelerators without disrupting server reliability.

FAQ

What is the GPU heatsink and thermal module market size in 2026?
The market is valued at USD 5.2 billion in 2026, according to Fact.MR.

What will the GPU heatsink market be worth in 2036?
The market is forecast to reach USD 17.8 billion by 2036.

What is the GPU heatsink market CAGR?
Fact.MR projects a 13.1% CAGR from 2026 to 2036.

Which cooling solution leads the market?
Air-cooled heatsinks lead with a 44.0% share in 2026.

Which country has the fastest growth?
Taiwan leads the listed countries at 14.4% CAGR through 2036.

About Fact.MR

Fact.MR provides market research and consulting services covering market sizing, forecasts, segmentation, country analysis, competitive landscapes, and strategic business insights.